Ultra-Wideband
HID Global Exhibits New Trusted Identity Solutions at GSX 2019
HID Global exhibits a host of new products, including biometrics at the door and new integrations at GSX 2019 HID booth. As a sponsor member of the recently launched FiRa? Consortium, HID Global will feature a demonstration of Ultra-Wideband (UWB) technology. The company will also showcase its award-winning HID Mobile Access solution and Seos credential technology.
Key Industry Players Establish FiRa Consortium to Drive Seamless User Experiences Using Ultra-Wideband Technology
Recognizing the need for emerging applications to build on a strong foundation that supports interoperability among all categories of devices, four sponsor-members ?The ASSA ABLOY Group which includes HID Global, and NXP Semiconductors, Samsung Electronics, and Bosch, leading companies in access, secure connectivity and mobile/CE device solutions? announced the launch of the FiRa Consortium. The new coalition is designed to grow the Ultra-Wideband ecosystem.